3DIC_MODEL1

Thermal Simulation for a Full BBCube

• Dimensions of the BBCube: 10 mm × 11 mm × 0.11 mm
• Interposer layer: 1 layer at the bottom of the package
• Memory layers: 10 layers above the interposer
• GPU layer: 1 layer on top of the BBCube
• Total TSVs: 21,728
• Materials used: Si, SiO₂, Copper
• Total heat sources distributed across all layers: 552.6 W
• Boundary conditions:
• Top and four sides: Convection with a film coefficient of 15,000 W/m²·K
• Bottom: Convection with a film coefficient of 4 W/m²·K
• Ambient temperature: 50°C

The image on the left shows the BBCube model, while the image on the right displays the temperature distribution generated by XSim-PAK. The simulation took 15 minutes to complete on an Intel CPU running at 2.4 GHz with four threads in parallel.