Top-Tier Thermomechanical Analysis
Resolve your thermal mechanical problems in semi-conductor package assembly and 3D printing with DGClaim.
Welcome to a World Where Technology Meets Precision, and Quality Meets Innovation.
Your cracking, delamination, warpage problems can be root-cause analyzed and resolved with DGClaim’s rich experiences to assure the reliability and quality of your semiconductor and 3D printing products
About
DGClaim is a thermal analysis tech company based in Portland Oregon. It is the brainchild of chief research scientist Doctor Jianping Xun who has an academic background in computational geometry, applied math, and over 30 years of experience in the chip design and manufacturing space.
What sets DG Claim apart from the crowd?
It’s our commitment to excellence and the innovation.
Our tools sit at the leading edge of market technology, at the boundary between research and market. The results of our internal techniques are IEEE published, and are executed with an emphasis on achieving product business needs and market impact.
Have a Question? Contact Us
Our unique craftsmanship, fused with a dedication to transparency, provides partners with products that deliver real, tangible results.
Ready to explore our extensive list of high-quality offerings? Reach out to us!