Top-Tier Thermomechanical Analysis and Datacenter design/automation Tools
Resolve your thermal mechanical problems in semi-conductor package assembly, 3D printing and data center with DGClaim.
Welcome to a World Where Technology Meets Precision, and Quality Meets Innovation.
Your cracking, delamination, warpage problems can be root-cause analyzed and resolved with DGClaim’s rich experiences to assure the reliability and quality of your semiconductor and 3D printing products
About
DGClaim is a thermal analysis/management tech company based in Portland Oregon. We specialize in accurate analysis by numerical methods for large physical models such as large semi-conductor packages, huge data centers.
What sets DG Claim apart from the crowd?
It’s our commitment to excellence and the innovation.
Our tools sit at the leading edge of market technology, at the boundary between research and market. The results of our internal techniques are IEEE published, and are executed with an emphasis on achieving product business needs and market impact.
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Our unique craftsmanship, fused with a dedication to transparency, provides partners with products that deliver real, tangible results.
Ready to explore our extensive list of high-quality offerings? Reach out to us!