Top-Tier Thermomechanical Analysis
Resolve your thermal mechanical problems in semi-conductor package assembly and 3D printing with DGClaim.
Welcome to a World Where Technology Meets Precision, and Quality Meets Innovation.
Your cracking, delamination, warpage problems can be root-cause analyzed and resolved with DGClaim’s rich experiences to assure the reliability and quality of your semiconductor and 3D printing products
About
At DG Claim, we understand the challenges faced by those in the computer and auto industries when it comes to component safety and longevity. We share your passion for perfection and your commitment to quality. We’re here to ensure your most critical parts are well-protected and performing at their peak.
What sets DG Claim apart from the crowd?
It’s our commitment to excellence and the unrivaled quality of our products.
When it comes to computer chips or car components, the key to ensuring their longevity and efficiency is a robust protective seal. This seal is not just a barrier; it’s a guardian, shielding the core of your devices and vehicles from harm.
Many industry-leading manufacturers trust our advanced semi-conductor packaging to safeguard their most important components. This isn’t just a protective measure; it’s a strategic decision that enhances performance and efficiency.
The semi-conductor packaging we offer isn’t just a case—it’s an investment in the long-term success of your business. We’re not just selling you a product; we’re providing a solution that reduces your labor cost and optimizes the functionality of your smaller parts.
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Our unique craftsmanship, fused with a dedication to transparency, provides partners with products that deliver real, tangible results.
Ready to explore our extensive list of high-quality offerings? Reach out to us!