3DIC_MODEL3

XSim-PAK Simulation of a 3DIC Package with 25 Layers and a Heat Sink on Top

In this model, the interposer layer and the XPU layer are the same as in Model 1. Between these two layers, there are 20 memory layers. In the middle of these memory layers, there is a GPU layer with a heat source of 100 W. The heat sink on top has the following parameters: inlet temperature = 47°C, outlet temperature = 50°C, and heat convection coefficient = 80,000 W/m²·K.

Compared to Model 2, the temperature is about 26°C higher due to the additional memory layers and the GPU layer in the middle, even though the heat sink is much stronger. The simulation took about 30 minutes on a CPU with a speed of 2.4 GHz and 4 threads running in parallel. Using more servers together may reduce the simulation time to around 10 minutes.