About DGClaim

DGClaim Inc is a high tech company based on Portland, Oregon. Our team members have many years of experiences in semi-conductor manufacturing, especially in root cause analysis of cracking, warping, delamination within package and die due to thermal/mechanical effects in manufacturing process for package assembly. We have a small but very experienced team that are eager to help with challenging reliability and quality problems of your semiconductor products.

Cracking, warping and delamination in semi-conductor manufacturing is a frequently happened problem during packaging operations. Understanding these problem could be very challenging. Our mission is to help our customers to root-cause analyze the problem and provide information for a solution.

Our advantages that make us stand out:

1. We developed powerful tools to help the analysis.
2. Our team has many years of related experiences.
3. We have strong passion to help.