XSim-PAK
Example Models
XSim-PAK is designed to be both accurate and fast for thermal and mechanical simulations of large semiconductor package models. It is FEA-based, which is known for its accuracy. It runs in parallel, making it fast and scalable for extremely large models. For a typical semiconductor package model with 20,000+ TSVs and 10+ layers with billion elements, the simulation takes only about 20 minutes to complete on a standard laptop using six threads. Simulations for extremely large models may take just about 10 minutes if more servers are used. The pages listed below verify the simulation accuracy and present various example models and results.