Identify Semiconductor Packaging Problems

At DG Claim, we offer comprehensive semi-conductor packaging analysis services. Our unique thermomechanical analysis is designed to diagnose your equipment’s issues accurately. Our groundbreaking 3D thermomechanical analysis dives deep into your equipment, identifying problems and providing solutions. Our 3D printing analysis offers a clear vision of your equipment’s current state, helping you identify what’s working and what needs attention. This allows us to preempt potential downtime, saving you from costly disruptions. We understand the importance of seamless operations. Our equipment ensures efficient circuit transportation, keeping your operations smooth and uninterrupted.